XC2V6000-5FF1152I vs XC2V6000-6FFG1152I feature comparison

XC2V6000-5FF1152I AMD Xilinx

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XC2V6000-6FFG1152I AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count 1152 1152
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz 820 MHz
Combinatorial Delay of a CLB-Max 0.39 ns 0.35 ns
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8448 8448
Number of Equivalent Gates 6000000 6000000
Number of Inputs 824
Number of Logic Cells 76032
Number of Outputs 824
Number of Terminals 1152 1152
Organization 8448 CLBS, 6000000 GATES 8448 CLBS, 6000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XC2V6000-5FF1152I with alternatives

Compare XC2V6000-6FFG1152I with alternatives