XC2V6000-5FF1152I vs XC3S4000-4FG1156C feature comparison

XC2V6000-5FF1152I AMD Xilinx

Buy Now Datasheet

XC3S4000-4FG1156C AMD Xilinx

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 BGA, BGA1156,34X34,40
Pin Count 1152 1156
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.39 ns 0.61 ns
JESD-30 Code S-PBGA-B1152 S-PBGA-B1156
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 3
Number of CLBs 8448 6912
Number of Equivalent Gates 6000000 4000000
Number of Inputs 824 712
Number of Logic Cells 76032 62208
Number of Outputs 824 712
Number of Terminals 1152 1156
Organization 8448 CLBS, 6000000 GATES 6912 CLBS, 4000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 2.6 mm
Supply Voltage-Max 1.575 V 1.26 V
Supply Voltage-Min 1.425 V 1.14 V
Supply Voltage-Nom 1.5 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 35 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC2V6000-5FF1152I with alternatives

Compare XC3S4000-4FG1156C with alternatives