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MAX3873EGP
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | BICMOS | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | SDH; SONET | 1 | INDUSTRIAL | S-CQCC-N20 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 20 | CERAMIC, METAL-SEALED COFIRED | VQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.90 MM HEIGHT, EXPOSED PAD, QFN-20 | 20 | not_compliant | EAR99 | 8542.39.00.01 | ||||||
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CYS25G0102DX-ATC
Cypress Semiconductor
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Check for Price | No | Obsolete | 2.5 V | BICMOS | ATM/SONET/SDH TRANSCEIVER | SONET | 1 | COMMERCIAL | S-PQFP-G120 | e0 | Not Qualified | 70 °C | 120 | PLASTIC/EPOXY | HLFQFP | QFP120,.63SQ,16 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 400 µm | QUAD | 14 mm | 14 mm | 1.6 mm | CYPRESS SEMICONDUCTOR CORP | QFP | HLFQFP, QFP120,.63SQ,16 | 120 | not_compliant | 8542.39.00.01 | ||||||||||
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GD16507-68BA
Giga
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Check for Price | No | Transferred | BICMOS | -5.2 V | 250 mA | S-XQFP-G68 | e0 | Not Qualified | 68 | CERAMIC | QFP | QFP68,.85SQ,40 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 1 mm | QUAD | GIGA | unknown | 8542.39.00.01 | ||||||||||||||||||||
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SY67672CQ
Synergy Semiconductor Corp
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Check for Price | No | Obsolete | 5 V | BICMOS | ATM/SONET/SDH TRANSCEIVER | 170 mA | COMMERCIAL | R-PQCC-J32 | e0 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | SYNERGY SEMICONDUCTOR CORP | unknown | 8542.39.00.01 | |||||||||||||||||
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GD16507-144EA
Intel Corporation
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Check for Price | No | No | Obsolete | BICMOS | ATM/SONET/SDH MUX/DEMUX | SDH; SONET | -5.2 V | 1 | 250 µA | OTHER | S-PBGA-B144 | e0 | Not Qualified | 85 °C | 144 | PLASTIC/EPOXY | LBGA | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 13 mm | 13 mm | 1.55 mm | INTEL CORP | BGA | LBGA, BGA144,12X12,40 | 144 | compliant | 8542.39.00.01 | ||||||||
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S3092CB20
Rochester Electronics LLC
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Check for Price | Active | 3.3 V | BICMOS | ATM/SONET/SDH RECEIVER | -5.2 V | 1 | COMMERCIAL | S-CBGA-B148 | COMMERCIAL | 70 °C | 148 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 3.1 mm | ROCHESTER ELECTRONICS LLC | BGA | CERAMIC, BGA-148 | 148 | unknown | |||||||||||||||
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MC2046Q16
Conexant Systems Inc
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Check for Price | No | Transferred | BICMOS | 1 | 40 mA | INDUSTRIAL | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | CONEXANT SYSTEMS | SSOP, SSOP16,.25 | compliant | 8542.39.00.01 | ||||||||||||||||
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MAX3873AETP+
Maxim Integrated Products
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$28.9191 | Yes | Yes | Transferred | 3.3 V | BICMOS | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | SDH; SONET | 1 | 142 µA | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC20,.16SQ,20 | 20 | compliant | EAR99 | 8542.39.00.01 | |||
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TTRN012G5
Broadcom Limited
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Check for Price | Active | 3.3 V | BICMOS | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | INDUSTRIAL | R-PQFP-G128 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 128 | PLASTIC/EPOXY | FQFP | RECTANGULAR | FLATPACK, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 13.89 mm | 19.86 mm | BROADCOM LTD | FQFP, | compliant | 8542.39.00.01 | |||||||||||||
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GD16505-68BA
Giga
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Check for Price | No | Transferred | BICMOS | -5.2 V | 250 mA | S-XQFP-G68 | e0 | Not Qualified | 68 | CERAMIC | QFP | QFP68,.85SQ,40 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 1 mm | QUAD | GIGA | unknown | 8542.39.00.01 |