Parametric results for: mc13892* under Power Management Circuits
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MC13892DJVL
NXP Semiconductors
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$4.7123 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1.5 mA | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B186 | e2 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 186 | PLASTIC/EPOXY | LFBGA | BGA186,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.6 mm | NXP SEMICONDUCTORS | 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 | compliant | EAR99 | 8542.39.00.01 | NXP | |||||
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MC13892CJVL
Freescale Semiconductor
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$4.7600 | Yes | Yes | Transferred | 3.6 V | 1.8 V | 3.6 V | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B186 | e2 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 186 | PLASTIC/EPOXY | LFBGA | BGA186,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.6 mm | FREESCALE SEMICONDUCTOR INC | 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 | compliant | EAR99 | 8542.39.00.01 | NXP | BGA | 186 | ||||
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MC13892CJVK
NXP Semiconductors
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$5.6169 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B139 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 139 | PLASTIC/EPOXY | TFBGA | BGA139,13X13,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 7 mm | 7 mm | 1.2 mm | NXP SEMICONDUCTORS | 7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-195AD, BGA-139 | compliant | EAR99 | 8542.39.00.01 | NXP | ||||||
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MC13892DJVLR2
NXP Semiconductors
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$5.7150 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1.5 mA | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B186 | e2 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 186 | PLASTIC/EPOXY | LFBGA | BGA186,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.6 mm | NXP SEMICONDUCTORS | 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 | compliant | EAR99 | 8542.39.00.01 | NXP | |||||
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MC13892DJVK
NXP Semiconductors
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$5.7264 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1.5 mA | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B139 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 139 | PLASTIC/EPOXY | TFBGA | BGA139,13X13,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper - with Nickel barrier | BALL | 500 µm | BOTTOM | 7 mm | 7 mm | 1.2 mm | NXP SEMICONDUCTORS | 7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-195AD, BGA-139 | compliant | EAR99 | 8542.39.00.01 | NXP | ||||||
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MC13892CJVL
NXP Semiconductors
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$6.3176 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B186 | e2 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 186 | PLASTIC/EPOXY | LFBGA | BGA186,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.6 mm | NXP SEMICONDUCTORS | 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 | compliant | EAR99 | 8542.39.00.01 | NXP | ||||||
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MC13892DJVKR2
NXP Semiconductors
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$7.9400 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1.5 mA | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B139 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 139 | PLASTIC/EPOXY | TFBGA | BGA139,13X13,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 7 mm | 7 mm | 1.2 mm | NXP SEMICONDUCTORS | TFBGA, BGA139,13X13,20 | compliant | EAR99 | 8542.39.00.01 | NXP | |||||
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MC13892CJVKR2
NXP Semiconductors
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$7.9400 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B139 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 139 | PLASTIC/EPOXY | TFBGA | BGA139,13X13,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 7 mm | 7 mm | 1.2 mm | NXP SEMICONDUCTORS | TFBGA, BGA139,13X13,20 | compliant | EAR99 | 8542.39.00.01 | NXP | ||||||
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MC13892CJVLR2
NXP Semiconductors
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$10.5412 | Yes | Active | 3.6 V | 1.8 V | 3.6 V | 1 | YES | YES | POWER SUPPLY MANAGEMENT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B186 | e2 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 186 | PLASTIC/EPOXY | LFBGA | BGA186,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.6 mm | NXP SEMICONDUCTORS | LFBGA, BGA186,14X14,32 | compliant | EAR99 | 8542.39.00.01 | NXP | ||||||
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935312766518
NXP Semiconductors
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Check for Price | Obsolete | POWER SUPPLY MANAGEMENT CIRCUIT | NXP SEMICONDUCTORS | , | unknown | EAR99 | 8542.39.00.01 |