1N3779E3
vs
1N821E3
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
O-XALF-W2
|
DIE-3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-7
|
DO-204AH
|
| JESD-30 Code |
O-XALF-W2
|
S-XXSS-N3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
SQUARE
|
| Package Style |
LONG FORM
|
SPECIAL SHAPE
|
| Power Dissipation-Max |
0.4 W
|
0.475 W
|
| Reference Voltage-Nom |
6.7 V
|
6.2 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WIRE
|
NO LEAD
|
| Terminal Position |
AXIAL
|
UNSPECIFIED
|
| Voltage Temp Coeff-Max |
1.005 mV/°C
|
0.62 mV/°C
|
| Voltage Tol-Max |
5%
|
4.84%
|
| Base Number Matches |
1
|
2
|
| Factory Lead Time |
|
26 Weeks
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
|
|
|
Compare 1N3779E3 with alternatives
Compare 1N821E3 with alternatives