1N5294PBFREE
vs
CH1N5294
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
MICROSEMI CORP
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Date Of Intro |
2018-01-18
|
|
Additional Feature |
HIGH RELIABILITY
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JEDEC-95 Code |
DO-35
|
|
JESD-30 Code |
O-XALF-W2
|
S-XUUC-N1
|
JESD-609 Code |
e3
|
e3
|
Limiting Voltage-Max |
1.2 V
|
1.2 V
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
1
|
Operating Temperature-Max |
200 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-55 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Dissipation-Max |
0.6 W
|
0.475 W
|
Regulation Current-Nom (Ireg) |
0.75 mA
|
0.75 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
NO
|
YES
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
MATTE TIN
|
TIN
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UPPER
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DIE
|
Package Description |
|
DIE-1
|
Pin Count |
|
1
|
HTS Code |
|
8541.10.00.40
|
Knee Impedance-Max |
|
335000 Ω
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare 1N5294PBFREE with alternatives
Compare CH1N5294 with alternatives