1T360
vs
BB151,115
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SONY CORP
|
NXP SEMICONDUCTORS
|
Package Description |
R-PDSO-F2
|
R-PDSO-G2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Breakdown Voltage-Min |
30 V
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance Ratio-Min |
11.5
|
1.45
|
Diode Capacitance-Nom |
31.25 pF
|
19.1 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
VARIABLE CAPACITANCE DIODE
|
VARIABLE CAPACITANCE DIODE
|
JESD-30 Code |
R-PDSO-F2
|
R-PDSO-G2
|
JESD-609 Code |
e0
|
e3
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
75 °C
|
150 °C
|
Operating Temperature-Min |
-20 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
35 V
|
|
Reverse Current-Max |
0.01 µA
|
|
Reverse Test Voltage |
28 V
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
TIN
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Variable Capacitance Diode Classification |
ABRUPT
|
ABRUPT
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SC-76
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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