24FC64T-I/MF
vs
24AA64-I/CS16K
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Factory Lead Time |
7 Weeks
|
|
| Additional Feature |
ALSO OPERATES AT 1.7V TO 2.5V @ 0.4MHZ
|
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
200
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| I2C Control Byte |
1010DDDR
|
|
| JESD-30 Code |
S-PDSO-N8
|
R-PBGA-B4
|
| JESD-609 Code |
e3
|
e1
|
| Length |
3 mm
|
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
8
|
4
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8KX8
|
8KX8
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
VFBGA
|
| Package Equivalence Code |
SOLCC8,.12,25
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
4.5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1 mm
|
0.55 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000001 A
|
|
| Supply Current-Max |
0.003 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
3 mm
|
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Package Description |
|
ROHS COMPLIANT, CSP-4
|
| Pin Count |
|
4
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 24FC64T-I/MF with alternatives
Compare 24AA64-I/CS16K with alternatives