24LC08B-I/MC
vs
M24C01-WDW1T
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
DFN
|
SOIC
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
DFN-8
|
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| Factory Lead Time |
9 Weeks
|
|
| Clock Frequency-Max (fCLK) |
0.4 Mhz
|
0.4 Mhz
|
| Data Retention Time-Min |
200
|
40
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010xmmr
|
1010dddr
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 Mm
|
4.4 Mm
|
| Memory Density |
8192 Bit
|
1024 Bit
|
| Memory IC Type |
Eeprom
|
Eeprom
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
1024 Words
|
128 Words
|
| Number of Words Code |
1000
|
128
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1kx8
|
128x8
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
HVSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC8,.11,20
|
TSSOP8,.25
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Heat Sink/Slug, Very Thin Profile
|
Small Outline, Thin Profile, Shrink Pitch
|
| Parallel/Serial |
Serial
|
Serial
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supplies |
2/5 V
|
3/5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 Mm
|
1.2 Mm
|
| Serial Bus Type |
I2c
|
I2c
|
| Standby Current-Max |
0.000001 A
|
5e-7 A
|
| Supply Current-Max |
0.003 Ma
|
0.001 Ma
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Commercial
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
No Lead
|
Gull Wing
|
| Terminal Pitch |
0.5 Mm
|
0.65 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
Not Specified
|
| Width |
2 Mm
|
3 Mm
|
| Write Cycle Time-Max (tWC) |
5 Ms
|
10 Ms
|
| Write Protection |
Hardware
|
Hardware
|
| Base Number Matches |
3
|
2
|
| Package Description |
|
Tssop, Tssop8,.25
|
| Output Characteristics |
|
Open-Drain
|
|
|
|