25AA256-E/MFG
vs
25AA256-I/STG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
TSSOP
|
| Package Description |
6 X 5 MM, PLASTIC, DFN-8
|
4.40 MM, PLASTIC, MO-153, TSSOP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
10 MHz
|
10 MHz
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5.99 mm
|
4.4 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Serial Bus Type |
SPI
|
SPI
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.92 mm
|
3 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Base Number Matches |
1
|
1
|
| Data Retention Time-Min |
|
200
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| Package Equivalence Code |
|
TSSOP8,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Standby Current-Max |
|
0.000001 A
|
| Supply Current-Max |
|
0.005 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare 25AA256-E/MFG with alternatives
Compare 25AA256-I/STG with alternatives