28LV64A-T-20/SO
vs
HY27UH08AG5BTC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SK HYNIX INC
|
| Part Package Code |
SOIC
|
TSOP1
|
| Package Description |
PLASTIC, SOIC-28
|
TSOP1,
|
| Pin Count |
28
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
200 ns
|
|
| Additional Feature |
MINIMUM 100K WRITE/ERASE CYCLE; 200 YEAR DATA RETENTION
|
|
| Command User Interface |
NO
|
|
| Data Polling |
YES
|
|
| Data Retention Time-Min |
200
|
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G48
|
| JESD-609 Code |
e3
|
|
| Length |
17.9 mm
|
18.4 mm
|
| Memory Density |
65536 bit
|
17179869184 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
48
|
| Number of Words |
8192 words
|
2147483648 words
|
| Number of Words Code |
8000
|
2000000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8KX8
|
2GX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSOP1
|
| Package Equivalence Code |
SOP28,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
|
| Seated Height-Max |
2.65 mm
|
1.2 mm
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.008 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Toggle Bit |
NO
|
|
| Width |
7.5 mm
|
12 mm
|
| Write Cycle Time-Max (tWC) |
3 ms
|
|
| Base Number Matches |
1
|
1
|
| Type |
|
SLC NAND TYPE
|
|
|
|
Compare 28LV64A-T-20/SO with alternatives
Compare HY27UH08AG5BTC with alternatives