5018/BWA vs NE5018F feature comparison

5018/BWA NXP Semiconductors

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NE5018F Signetics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SIGNETICS CORP
Part Package Code DIP
Package Description DIP, DIP, DIP22,.4
Pin Count 22
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Analog Output Voltage-Max 5.5 V
Analog Output Voltage-Min -5.25 V
Converter Type D/A CONVERTER D/A CONVERTER
Input Bit Code BINARY BINARY, OFFSET BINARY
Input Format PARALLEL, 8 BITS
JESD-30 Code R-CDIP-T22 R-CDIP-T22
Linearity Error-Max (EL) 0.19% 0.19%
Negative Supply Voltage-Nom -15 V -15 V
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 22 22
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Settling Time-Nom (tstl) 1.8 µs
Supply Current-Max 15 mA 15 mA
Supply Voltage-Nom 15 V 15 V
Surface Mount NO NO
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP22,.4
Technology BIPOLAR
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm

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