5018/BWA
vs
SE5018N
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP,
|
0.400 INCH, PLASTIC, DIP-22
|
Pin Count |
22
|
22
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
5.5 V
|
5.25 V
|
Analog Output Voltage-Min |
-5.25 V
|
-5.25 V
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
JESD-30 Code |
R-CDIP-T22
|
R-PDIP-T22
|
Linearity Error-Max (EL) |
0.19%
|
0.19%
|
Negative Supply Voltage-Nom |
-15 V
|
-15 V
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
22
|
22
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Settling Time-Nom (tstl) |
1.8 µs
|
2.3 µs
|
Supply Current-Max |
15 mA
|
15 mA
|
Supply Voltage-Nom |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Length |
|
28 mm
|
Package Equivalence Code |
|
DIP22,.4
|
Seated Height-Max |
|
4.83 mm
|
Technology |
|
BIPOLAR
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
10.16 mm
|
|
|
|
Compare 5018/BWA with alternatives
Compare SE5018N with alternatives