5962-3826705MUA vs 5962-3826705MZX feature comparison

5962-3826705MUA Xicor Inc

Buy Now Datasheet

5962-3826705MZX LSI Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC SEEQ TECHNOLOGY INC
Package Description CERAMIC, LCC-32 DFP,
Reach Compliance Code unknown unknown
Access Time-Max 150 ns 150 ns
JESD-30 Code R-CQCC-N32 R-CDFP-F32
JESD-609 Code e0 e0
Length 13.965 mm 20.85 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER FLATPACK
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 3.05 mm 3.05 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD DUAL
Width 11.425 mm 12.2 mm
Base Number Matches 1 1
Pbfree Code No
Part Package Code DFP
Pin Count 32
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Additional Feature AUTOMATIC WRITE; DATA RETENTION: 10 YEARS
Data Retention Time-Min 10
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Write Cycle Time-Max (tWC) 10 ms

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