5962-9471701MPX vs XC1765EPD8C feature comparison

5962-9471701MPX AMD Xilinx

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XC1765EPD8C AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 5 MHz 10 MHz
JESD-30 Code R-GDIP-T8 R-PDIP-T8
Memory Density 65536 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 64KX1 64KX1
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
I/O Type COMMON
JESD-609 Code e0
Length 9.3599 mm
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.5974 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.01 mA
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

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Compare XC1765EPD8C with alternatives