63S140JXXXX
vs
M38510/20302BEX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MONOLITHIC MEMORIES
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
45 ns
|
55 ns
|
| JESD-30 Code |
R-GDIP-T16
|
R-XDIP-T16
|
| Memory Density |
8192 bit
|
8192 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
1000
|
2000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
1KX8
|
2KX4
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.13 mA
|
0.155 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Package Description |
|
DIP,
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Package Code |
|
DIP
|
|
|
|
Compare 63S140JXXXX with alternatives
Compare M38510/20302BEX with alternatives