8001203JX vs WS57C43C-25D feature comparison

8001203JX Intel Corporation

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WS57C43C-25D STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, 0.600 INCH, CERDIP-24
Pin Count 24 24
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 25 ns
JESD-30 Code R-XDIP-T24 R-GDIP-T24
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 4KX8 4KX8
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Current-Max 0.15 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 32.135 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.6
Seated Height-Max 5.72 mm
Standby Current-Max 0.03 A
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 8001203JX with alternatives

Compare WS57C43C-25D with alternatives