93AA66C/P vs 93AA66C-E/MS feature comparison

93AA66C/P Microchip Technology Inc

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93AA66C-E/MS Microchip Technology Inc

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Part Life Cycle Code Active Unconfirmed Active
Package Description Dip, Dip8,.3 Lssop,
Reach Compliance Code Compliant Compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 8 8
Clock Frequency-Max (fCLK) 2 Mhz 2 Mhz
Data Retention Time-Min 200
Endurance 10000000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDSO-G6
Length 9.46 Mm 2.95 Mm
Memory Density 4096 Bit 1024 Bit
Memory IC Type Eeprom Eeprom
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 8 6
Number of Words 256 Words 128 Words
Number of Words Code 256 128
Operating Mode Synchronous Synchronous
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 256x16 128x8
Output Characteristics 3-State
Package Body Material Plastic/Epoxy Plastic/Epoxy
Package Code DIP LSSOP
Package Equivalence Code DIP8,.3
Package Shape Rectangular Rectangular
Package Style In-Line Small Outline, Low Profile, Shrink Pitch
Parallel/Serial Serial Serial
Programming Voltage 3 V
Screening Level Ts 16949 Aec-Q100
Seated Height-Max 4.32 Mm 1.45 Mm
Serial Bus Type Microwire Microwire
Standby Current-Max 0.00003 A
Supply Current-Max 0.003 Ma 0.002 Ma
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount No Yes
Technology Cmos Cmos
Temperature Grade Commercial Industrial
Terminal Form Through-Hole Gull Wing
Terminal Pitch 2.54 Mm 0.95 Mm
Terminal Position Dual Dual
Width 7.62 Mm 1.63 Mm
Write Cycle Time-Max (tWC) 10 Ms 6 Ms
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOT-23
Pin Count 6
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40