93AA66C-I/PG
vs
CAT93C66LE-G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
CATALYST SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
|
,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
ALSO CONFIGURABLE AS 512 X 8
|
|
| Alternate Memory Width |
8
|
|
| Clock Frequency-Max (fCLK) |
3 MHz
|
|
| Data Retention Time-Min |
200
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDIP-T8
|
|
| JESD-609 Code |
e3
|
|
| Length |
9.27 mm
|
|
| Memory Density |
4096 bit
|
|
| Memory IC Type |
EEPROM
|
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
256 words
|
|
| Number of Words Code |
256
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256X16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
SERIAL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.33 mm
|
|
| Serial Bus Type |
MICROWIRE
|
|
| Standby Current-Max |
0.000001 A
|
|
| Supply Current-Max |
0.002 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
7.62 mm
|
|
| Write Cycle Time-Max (tWC) |
6 ms
|
|
| Write Protection |
SOFTWARE
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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