93LC56B-I/STRVA
vs
93LC56B-I/STG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Package Description |
Tssop,
|
Tssop, Tssop8,.25
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Factory Lead Time |
28 Weeks
|
|
| Additional Feature |
1000000 Erase/Write Cycles Min; Data Retention ≫ 200 Years
|
|
| Alternate Memory Width |
8
|
8
|
| Clock Frequency-Max (fCLK) |
2 Mhz
|
2 Mhz
|
| Data Retention Time-Min |
200
|
200
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Length |
4.4 Mm
|
4.4 Mm
|
| Memory Density |
2048 Bit
|
2048 Bit
|
| Memory IC Type |
Eeprom
|
Eeprom
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
128 Words
|
128 Words
|
| Number of Words Code |
128
|
128
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128x16
|
128x16
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Thin Profile, Shrink Pitch
|
Small Outline, Thin Profile, Shrink Pitch
|
| Parallel/Serial |
Serial
|
Serial
|
| Peak Reflow Temperature (Cel) |
Not Specified
|
260
|
| Screening Level |
Ts 16949
|
Aec-Q100
|
| Seated Height-Max |
1.2 Mm
|
1.2 Mm
|
| Serial Bus Type |
Microwire
|
Microwire
|
| Supply Current-Max |
0.002 Ma
|
0.002 Ma
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.65 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
Not Specified
|
40
|
| Width |
3 Mm
|
3 Mm
|
| Write Cycle Time-Max (tWC) |
6 Ms
|
6 Ms
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP8,.25
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.000001 A
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Write Protection |
|
Software
|
|
|
|