93LC66AT-E/P
vs
S25FL032P0XNFV013
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SPANSION INC
|
| Part Package Code |
DIP
|
SON
|
| Package Description |
DIP,
|
6 X 8 MM, LEAD FREE, PLASTIC, WSON-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.A
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Alternate Memory Width |
8
|
|
| Clock Frequency-Max (fCLK) |
2 MHz
|
104 MHz
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
|
| Length |
9.46 mm
|
8 mm
|
| Memory Density |
1024 bit
|
33554432 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
128 words
|
4194304 words
|
| Number of Words Code |
128
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128X8
|
4MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
4.32 mm
|
0.8 mm
|
| Serial Bus Type |
MICROWIRE
|
QSPI
|
| Supply Current-Max |
0.003 mA
|
0.038 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
6 mm
|
| Write Cycle Time-Max (tWC) |
6 ms
|
|
| Base Number Matches |
1
|
1
|
| Data Retention Time-Min |
|
20
|
| Endurance |
|
100000 Write/Erase Cycles
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
SOLCC8,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Programming Voltage |
|
3 V
|
| Standby Current-Max |
|
0.00001 A
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Type |
|
NOR TYPE
|
| Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare 93LC66AT-E/P with alternatives
Compare S25FL032P0XNFV013 with alternatives