ADC12DJ3200ZEG
vs
ADC12DJ3200NWE/EM
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
FBGA,
|
CGA,
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A001.A.5.A.3
|
3A001.A.5.A.3
|
HTS Code |
8542.39.00.01
|
8473.30.11.80
|
Date Of Intro |
2019-01-08
|
2020-07-03
|
Additional Feature |
Peak-to-peak input voltage range(V) : 0.8
|
Peak-to-peak input voltage range(V) : 0.8
|
Analog Input Voltage-Max |
1.04 V
|
0.8 V
|
Analog Input Voltage-Min |
-0.5 V
|
-0.8 V
|
Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
JESD-30 Code |
S-PBGA-B144
|
S-CCGA-X196
|
JESD-609 Code |
e0
|
|
Length |
10 mm
|
15 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Analog In Channels |
1
|
2
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
144
|
196
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
FBGA
|
CGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
235
|
|
Sample Rate |
6400 MHz
|
3200 MHz
|
Seated Height-Max |
1.94 mm
|
6.194 mm
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
BALL
|
UNSPECIFIED
|
Terminal Pitch |
0.8 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
10 mm
|
15 mm
|
Base Number Matches |
2
|
1
|
Sample and Hold / Track and Hold |
|
TRACK
|
Supply Current-Max |
|
1000 mA
|
Total Dose |
|
300k Rad(Si) V
|
|
|
|
Compare ADC12DJ3200ZEG with alternatives
Compare ADC12DJ3200NWE/EM with alternatives