AS4C8M32SA-7BCN
vs
SCX33S256320AE-6EBI
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
ALLIANCE MEMORY INC
|
XIAN UNILC SEMICONDUCTORS CO LTD
|
Package Description |
FBGA-90
|
TSOP2,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.24
|
8542.32.00.24
|
Factory Lead Time |
20 Weeks
|
|
Date Of Intro |
2016-11-16
|
|
Samacsys Manufacturer |
Alliance Memory
|
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
5.4 ns
|
5.4 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-PBGA-B90
|
R-PDSO-G86
|
Length |
13 mm
|
22.22 mm
|
Memory Density |
268435456 bit
|
268435456 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
32
|
32
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
90
|
86
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
8MX32
|
8MX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TSOP2
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
8 mm
|
10.16 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare AS4C8M32SA-7BCN with alternatives
Compare SCX33S256320AE-6EBI with alternatives