AT24C02C-TSUM-T
vs
AT24C02CU3-CUM-T
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Part Package Code |
TSOT
|
|
| Package Description |
Tssop,
|
Vfbga,
|
| Pin Count |
5
|
|
| Reach Compliance Code |
Unknown
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
100 Year Data Retention
|
100 Year Data Retention
|
| Clock Frequency-Max (fCLK) |
1 Mhz
|
1 Mhz
|
| Data Retention Time-Min |
100
|
100
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010dddr
|
1010dddr
|
| JESD-30 Code |
R-PDSO-G5
|
R-PBGA-B8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.9 Mm
|
2 Mm
|
| Memory Density |
2097152 Bit
|
2097152 Bit
|
| Memory IC Type |
Eeprom
|
Eeprom
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Number of Words |
262144 Words
|
262144 Words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256kx8
|
256kx8
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Thin Profile, Shrink Pitch
|
Grid Array, Very Thin Profile, Fine Pitch
|
| Parallel/Serial |
Serial
|
Serial
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 Mm
|
0.85 Mm
|
| Serial Bus Type |
I2c
|
I2c
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Matte Tin
|
Matte Tin
|
| Terminal Form |
Gull Wing
|
Ball
|
| Terminal Pitch |
0.95 Mm
|
0.5 Mm
|
| Terminal Position |
Dual
|
Bottom
|
| Width |
1.6 Mm
|
1.5 Mm
|
| Write Cycle Time-Max (tWC) |
5 Ms
|
5 Ms
|
| Base Number Matches |
2
|
2
|
|
|
|