AT24C02C-WWU11M
vs
AT24C02CU3-CUM-T
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Package Description |
DIE,
|
VFBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A991.B.1.B.1
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
ALSO OPERATES 1.7V AT 400 KHZ
|
100 YEAR DATA RETENTION
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
1 MHz
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDDR
|
1010DDDR
|
| JESD-30 Code |
X-XUUC-N
|
R-PBGA-B8
|
| Memory Density |
2048 bit
|
2097152 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
256 words
|
262144 words
|
| Number of Words Code |
256
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256X8
|
256KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
VFBGA
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Serial Bus Type |
I2C
|
I2C
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Position |
UPPER
|
BOTTOM
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
8
|
| Data Retention Time-Min |
|
100
|
| JESD-609 Code |
|
e3
|
| Length |
|
2 mm
|
| Number of Terminals |
|
8
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.85 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
1.5 mm
|
|
|
|
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