BAS40LT1G
vs
BAS4002LE6327XTMA1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
SOT-23 (TO-236) 3 LEAD
|
|
| Package Description |
Halogen Free And Rohs Compliant, Miniature, Case 318 -08, 3 Pin
|
Rohs Compliant, Leadless, Tslp-2-1, 2 Pin
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
318
|
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Factory Lead Time |
10 Weeks
|
13 Weeks
|
| Application |
General Purpose
|
General Purpose
|
| Configuration |
Single
|
Single
|
| Diode Element Material |
Silicon
|
Silicon
|
| Diode Type |
Rectifier Diode
|
Bridge Rectifier Diode
|
| Forward Voltage-Max (VF) |
0.38 V
|
|
| JEDEC-95 Code |
TO-236AB
|
|
| JESD-30 Code |
R-PDSO-G3
|
R-XBCC-N2
|
| JESD-609 Code |
e3
|
e4
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
0.6 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
3
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
0.12 A
|
0.12 A
|
| Package Body Material |
Plastic/Epoxy
|
Unspecified
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline
|
Chip Carrier
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Dissipation-Max |
0.225 W
|
0.25 W
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
40 V
|
40 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Schottky
|
Schottky
|
| Terminal Finish |
Matte Tin (Sn) - Annealed
|
Gold (Au)
|
| Terminal Form |
Gull Wing
|
No Lead
|
| Terminal Position |
Dual
|
Bottom
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
1
|
1
|
|
|
|