BAT17/T3
vs
BAT17,235
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.60
|
8541.10.00.70
|
| Date Of Intro |
2017-02-01
|
|
| Diode Type |
MIXER DIODE
|
MIXER DIODE
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
TIN
|
TIN
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
TO-236
|
| Pin Count |
|
3
|
| Manufacturer Package Code |
|
SOT23
|
| Factory Lead Time |
|
4 Weeks
|
| Breakdown Voltage-Min |
|
4 V
|
| Configuration |
|
SINGLE
|
| Diode Capacitance-Max |
|
1 pF
|
| Diode Element Material |
|
SILICON
|
| Forward Voltage-Max (VF) |
|
0.6 V
|
| Frequency Band |
|
ULTRA HIGH FREQUENCY
|
| JESD-30 Code |
|
R-PDSO-G3
|
| Noise Figure-Max |
|
8 dB
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Max |
|
100 °C
|
| Output Current-Max |
|
30 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Reverse Current-Max |
|
0.25 µA
|
| Surface Mount |
|
YES
|
| Technology |
|
SCHOTTKY
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare BAT17/T3 with alternatives
Compare BAT17,235 with alternatives
-
BAT17,235 vs BAT17
-
BAT17,235 vs SMMBD301LT3G
-
BAT17,235 vs SMMBD301LT3
-
BAT17,235 vs BAT17-T
-
BAT17,235 vs MMBD301LT3
-
BAT17,235 vs 933410700215
-
BAT17,235 vs BAT17T/R
-
BAT17,235 vs BAT17,215
-
BAT17,235 vs 933410700235