BU2525AX vs BU2525DW feature comparison

BU2525AX NXP Semiconductors

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BU2525DW NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOT TO-247
Package Description PLASTIC, SOT-399, 3 PIN FLANGE MOUNT, R-PSFM-T3
Pin Count 3 3
Manufacturer Package Code SOT399
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection ISOLATED COLLECTOR
Collector Current-Max (IC) 12 A 12 A
Collector-Emitter Voltage-Max 800 V 800 V
Configuration SINGLE SINGLE WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 5 5
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 45 W
Power Dissipation-Max (Abs) 45 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Turn-off Time-Max (toff) 4350 ns
VCEsat-Max 5 V
Base Number Matches 1 1
Additional Feature BUILT-IN BIAS RESISTOR
JEDEC-95 Code TO-247

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