BU9888FV-WE2
vs
11AA010-I/P
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
LSSOP, TSSOP8,.25
|
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
2 MHz
|
1 MHz
|
| Data Retention Time-Min |
40
|
200
|
| Endurance |
100000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| Length |
3 mm
|
9.271 mm
|
| Memory Density |
4096 bit
|
1024 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
16
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
256 words
|
128 words
|
| Number of Words Code |
256
|
128
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Organization |
256X16
|
128X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.35 mm
|
5.334 mm
|
| Serial Bus Type |
3-WIRE
|
1-WIRE
|
| Standby Current-Max |
0.000002 A
|
0.000005 A
|
| Supply Current-Max |
0.0035 mA
|
0.005 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.4 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
2 ms
|
10 ms
|
| Write Protection |
SOFTWARE
|
SOFTWARE
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Number of Ports |
|
1
|
| Output Characteristics |
|
TOTEM POLE
|
| Ready/Busy |
|
NO
|
| Reverse Pinout |
|
NO
|
| Screening Level |
|
TS 16949
|
| Terminal Finish |
|
MATTE TIN
|
| Toggle Bit |
|
NO
|
|
|
|
Compare BU9888FV-WE2 with alternatives
Compare 11AA010-I/P with alternatives