CMX813P3 vs BA4118FV feature comparison

CMX813P3 Mx Com Inc

Buy Now Datasheet

BA4118FV ROHM Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MX COM INC ROHM CO LTD
Part Package Code DIP SOIC
Package Description DIP, LSSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.685 mm 5 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.25 mm
Supply Current-Max 2 mA
Supply Voltage-Nom 5 V 1.4 V
Surface Mount NO YES
Telecom IC Type PAGING DECODER PAGING RECEIVER
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 6.375 mm 4.4 mm
Base Number Matches 1 5
Rohs Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare CMX813P3 with alternatives

Compare BA4118FV with alternatives