CY7C261-45PC vs 8200903JA feature comparison

CY7C261-45PC Cypress Semiconductor

Buy Now Datasheet

8200903JA NXP Semiconductors

Buy Now
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP24,.3 DIP,
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 45 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 31.75 mm
Memory Density 65536 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 4
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 4KX4
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.03 A
Supply Current-Max 0.1 mA 0.19 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Screening Level MIL-STD-883

Compare CY7C261-45PC with alternatives

Compare 8200903JA with alternatives