Part Details for 8200903JA by NXP Semiconductors
Overview of 8200903JA by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Security and Surveillance
Audio and Video Systems
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for 8200903JA
8200903JA CAD Models
8200903JA Part Data Attributes
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8200903JA
NXP Semiconductors
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8200903JA
NXP Semiconductors
IC 8K X 8 OTPROM, 45 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 45 ns | |
| JESD-30 Code | R-GDIP-T24 | |
| Memory Density | 16384 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8192 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 4KX4 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Supply Current-Max | 0.19 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 8200903JA
This table gives cross-reference parts and alternative options found for 8200903JA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8200903JA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 93Z565ADCQR | OTP ROM, 8KX8, 45ns, TTL, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 8200903JA vs 93Z565ADCQR |
| CY7C263-45DC | OTP ROM, 8KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | Cypress Semiconductor | 8200903JA vs CY7C263-45DC |
| 5962-9080306MLX | OTP ROM, 8KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | 8200903JA vs 5962-9080306MLX |
| AT27HC642R-45PC | OTP ROM, 8KX8, 45ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Atmel Corporation | 8200903JA vs AT27HC642R-45PC |
| 93Z564ADCQR | OTP ROM, 8KX8, 45ns, TTL, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 8200903JA vs 93Z564ADCQR |
| MB71C44-45ZSK | OTP ROM, 8KX8, 45ns, BICMOS, CDIP24, 0.300 INCH, CERDIP-24 | FUJITSU Semiconductor Limited | 8200903JA vs MB71C44-45ZSK |
| 93Z565ADC | OTP ROM, 8KX8, 45ns, TTL, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 8200903JA vs 93Z565ADC |
| 93Z564ADC | OTP ROM, 8KX8, 45ns, TTL, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 8200903JA vs 93Z564ADC |
| 27HC641-45N | OTP ROM, 8KX8, 45ns, CMOS, PDIP24 | YAGEO Corporation | 8200903JA vs 27HC641-45N |
| N82HS641AF | OTP ROM, 8KX8, 45ns, Bipolar, CDIP24 | Signetics | 8200903JA vs N82HS641AF |