DAC5687IPZPR
vs
DAC5687IPZPRG4
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
Htfqfp, Tqfp100,.63sq
|
Htfqfp, Tqfp100,.63sq
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
Compliant
|
Unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.40
|
8542.39.00.01
|
| Analog Output Voltage-Max |
4.1 V
|
4.1 V
|
| Analog Output Voltage-Min |
2.5 V
|
2.5 V
|
| Converter Type |
D/A Converter
|
D/A Converter
|
| Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
Parallel, Word
|
Parallel, Word
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e4
|
e4
|
| Length |
14 Mm
|
14 Mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
HTFQFP
|
HTFQFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
TQFP100,.63SQ
|
| Package Shape |
Square
|
Square
|
| Package Style |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch
|
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
500 Mhz
|
|
| Seated Height-Max |
1.2 Mm
|
1.2 Mm
|
| Settling Time-Nom (tstl) |
0.0104 µS
|
0.0104 µS
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel Palladium Gold
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.5 Mm
|
0.5 Mm
|
| Terminal Position |
Quad
|
Quad
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
14 Mm
|
14 Mm
|
| Base Number Matches |
1
|
1
|
|
|
|