DAC5687IPZPRG4
vs
DAC5686PZP
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HTFQFP, TQFP100,.63SQ
|
HTFQFP,
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
4.1 V
|
|
| Analog Output Voltage-Min |
2.5 V
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e4
|
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
HTFQFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Settling Time-Nom (tstl) |
0.0104 µs
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DAC5687IPZPRG4 with alternatives
Compare DAC5686PZP with alternatives