DG303BDJ-E3
vs
DG181BP
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
HARRIS SEMICONDUCTOR
|
| Package Description |
DIP-14
|
DIP, DIP14,.3
|
| Reach Compliance Code |
compliant
|
unknown
|
| Samacsys Manufacturer |
Vishay
|
|
| Analog IC - Other Type |
DPST
|
SPST
|
| Input Voltage-Max |
15 V
|
|
| Input Voltage-Min |
-15 V
|
|
| JESD-30 Code |
R-PDIP-T14
|
R-CDIP-T14
|
| JESD-609 Code |
e3
|
e0
|
| Length |
18.285 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Normal Position |
NO/NC
|
NC
|
| Number of Channels |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Off-state Isolation-Nom |
62 dB
|
50 dB
|
| On-state Resistance-Max (Ron) |
50 Ω
|
50 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max (Isup) |
1 mA
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
130 ns
|
150 ns
|
| Switch-on Time-Max |
150 ns
|
180 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
MAKE-BEFORE-BREAK
|
| Technology |
CMOS
|
JFET
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare DG303BDJ-E3 with alternatives
Compare DG181BP with alternatives