DS2407P vs DS28E02P+ feature comparison

DS2407P Dallas Semiconductor

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DS28E02P+ Maxim Integrated Products

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer DALLAS SEMICONDUCTOR MAXIM INTEGRATED PRODUCTS INC
Package Description 3.70 X 4 X 1.50 MM, TSOC-6 SOC, SOC6,.17
Reach Compliance Code unknown compliant
JESD-30 Code R-PDSO-C6 R-PDSO-C6
JESD-609 Code e0 e3
Memory Density 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 6 6
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -20 °C
Organization 1KX1 1KX1
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOC SOC
Package Equivalence Code SOC6,.17 SOC6,.17
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Serial Bus Type 1-WIRE 1-WIRE
Supply Voltage-Max (Vsup) 6 V 3.65 V
Supply Voltage-Min (Vsup) 2.8 V 1.75 V
Supply Voltage-Nom (Vsup) 4 V 1.8 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form C BEND C BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code Yes
Part Package Code SOIC
Pin Count 6
ECCN Code EAR99
HTS Code 8542.32.00.51
Data Retention Time-Min 40
Endurance 50000 Write/Erase Cycles
Length 3.94 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.5 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.76 mm

Compare DS2407P with alternatives

Compare DS28E02P+ with alternatives