DS2407P
vs
DS28E02P+
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
DALLAS SEMICONDUCTOR
MAXIM INTEGRATED PRODUCTS INC
Package Description
3.70 X 4 X 1.50 MM, TSOC-6
SOC, SOC6,.17
Reach Compliance Code
unknown
compliant
JESD-30 Code
R-PDSO-C6
R-PDSO-C6
JESD-609 Code
e0
e3
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
6
6
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-20 °C
Organization
1KX1
1KX1
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOC
SOC
Package Equivalence Code
SOC6,.17
SOC6,.17
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Serial Bus Type
1-WIRE
1-WIRE
Supply Voltage-Max (Vsup)
6 V
3.65 V
Supply Voltage-Min (Vsup)
2.8 V
1.75 V
Supply Voltage-Nom (Vsup)
4 V
1.8 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
C BEND
C BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Pbfree Code
Yes
Part Package Code
SOIC
Pin Count
6
ECCN Code
EAR99
HTS Code
8542.32.00.51
Data Retention Time-Min
40
Endurance
50000 Write/Erase Cycles
Length
3.94 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
3.76 mm
Compare DS2407P with alternatives
Compare DS28E02P+ with alternatives