DS2502X1 vs DS2502R/T&R feature comparison

DS2502X1 Maxim Integrated Products

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DS2502R/T&R Maxim Integrated Products

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC MAXIM INTEGRATED PRODUCTS INC
Package Description CSP-2 TSSOP, TO-236
Reach Compliance Code compliant not_compliant
Access Time-Max 15000 ns 15000 ns
Additional Feature MICROLAN COMPATIBLE MICROLAN COMPATIBLE
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B2 R-PDSO-G3
JESD-609 Code e0 e0
Length 1.6 mm 2.92 mm
Memory Density 1024 bit 1024 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 2 3
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VBGA TSSOP
Package Equivalence Code BGA2,1X2,37 TO-236
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.639 mm 1.12 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2.8 V 2.8 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.933 mm 0.95 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 0.91 mm 1.3 mm
Base Number Matches 2 1
Part Package Code SOT-23
Pin Count 3
ECCN Code EAR99
HTS Code 8542.32.00.71

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