EDI8833LP55CB vs 5962-8866203XX feature comparison

EDI8833LP55CB Electronic Designs Inc

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5962-8866203XX Pyramid Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ELECTRONIC DESIGNS INC PYRAMID SEMICONDUCTOR CORP
Reach Compliance Code unknown compliant
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.00035 A
Standby Voltage-Min 2 V
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 14
Part Package Code DIP
Package Description DIP,
Pin Count 28
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41

Compare EDI8833LP55CB with alternatives

Compare 5962-8866203XX with alternatives