EP610DM883B
vs
PAL16R8AML883B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
MONOLITHIC MEMORIES
|
| Package Description |
DIP, DIP24,.3
|
QCCN, LCC20,.35SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
28.6 MHz
|
20 MHz
|
| JESD-30 Code |
R-XDIP-T24
|
S-XQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Number of Inputs |
20
|
8
|
| Number of Outputs |
16
|
8
|
| Number of Product Terms |
160
|
64
|
| Number of Terminals |
24
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Function |
MACROCELL
|
REGISTERED
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP24,.3
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Propagation Delay |
37 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
3
|
1
|
| Programmable Logic Type |
|
OT PLD
|
|
|
|
Compare EP610DM883B with alternatives
Compare PAL16R8AML883B with alternatives