EPC1064PI8 vs XC1765EPD8I feature comparison

EPC1064PI8 Intel Corporation

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XC1765EPD8I Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Package Description DIP-8 DIP,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 75 ns
Clock Frequency-Max (fCLK) 4 MHz
I/O Type COMMON
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.398 mm 9.3599 mm
Memory Density 65536 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX1 64KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.318 mm 4.5974 mm
Standby Current-Max 0.0002 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code DIP
Pin Count 8
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code e0
Moisture Sensitivity Level 1
Terminal Finish TIN LEAD

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