F356635S vs X88C64D feature comparison

F356635S Fairchild Semiconductor Corporation

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X88C64D Xicor Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP XICOR INC
Part Package Code DIP
Package Description DIP, HERMETIC SEALED, CERDIP-24
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns 120 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Length 32.0675 mm 32.07 mm
Memory Density 4194304 bit 65536 bit
Memory IC Type MASK ROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 512KX8 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.37 mm 5.72 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Rohs Code No
Additional Feature PAGE WRITE
Command User Interface NO
Data Polling NO
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code DIP24,.6
Page Size 32 words
Programming Voltage 5 V
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Toggle Bit YES

Compare F356635S with alternatives

Compare X88C64D with alternatives