FSA66M5X
vs
TS5A1066YEPR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
LSSOP, TSOP5/6,.11,37
|
VFBGA, BGA5,2X3,20
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G5
|
R-PBGA-B5
|
| JESD-609 Code |
e3
|
|
| Length |
2.9 mm
|
1.4 mm
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Off-state Isolation-Nom |
50 dB
|
68 dB
|
| On-state Resistance Match-Nom |
125 Ω
|
|
| On-state Resistance-Max (Ron) |
60 Ω
|
80 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
VFBGA
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
BGA5,2X3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
18.2 ns
|
5.5 ns
|
| Switch-on Time-Max |
14.2 ns
|
13 ns
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.95 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
1.6 mm
|
0.9 mm
|
| Base Number Matches |
1
|
1
|
| Normal Position |
|
NO
|
| Switching |
|
BREAK-BEFORE-MAKE
|
|
|
|
Compare FSA66M5X with alternatives
Compare TS5A1066YEPR with alternatives