GWIXP455BAC
vs
GWIXP465AAB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
PLASTIC, BGA-544
|
HBGA,
|
| Pin Count |
544
|
544
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
33.33 MHz
|
66 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B544
|
S-PBGA-B544
|
| Length |
35 mm
|
35 mm
|
| Low Power Mode |
YES
|
NO
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
544
|
544
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
HBGA
|
| Package Equivalence Code |
BGA544,26X26,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, HEAT SINK/SLUG
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.17 mm
|
2.51 mm
|
| Speed |
400 MHz
|
266 MHz
|
| Supply Voltage-Max |
3.465 V
|
1.365 V
|
| Supply Voltage-Min |
3.135 V
|
1.235 V
|
| Supply Voltage-Nom |
3.3 V
|
1.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
|
|
|
Compare GWIXP455BAC with alternatives
Compare GWIXP465AAB with alternatives