HD74HC132P vs 74HC132D feature comparison

HD74HC132P Hitachi Ltd

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74HC132D Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer HITACHI LTD TOSHIBA CORP
Part Package Code DIP
Package Description DIP, DIP14,.3 SOIC-14
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.2 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.0052 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.23
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TR
Prop. Delay@Nom-Sup 25 ns
Propagation Delay (tpd) 125 ns 160 ns
Qualification Status Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 5.06 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Factory Lead Time 53 Weeks, 1 Day
Date Of Intro 2016-05-25
Samacsys Manufacturer Toshiba
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 50 mA
Time@Peak Reflow Temperature-Max (s) 30

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