HSM88WK
vs
PMBD353,235
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NXP SEMICONDUCTORS
|
Package Description |
MPAK-3
|
PLASTIC, TO-236AB, 3 PIN
|
Pin Count |
3
|
3
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.60
|
8541.10.00.70
|
Configuration |
COMMON CATHODE, 2 ELEMENTS
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
Diode Capacitance-Max |
0.85 pF
|
1 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
MIXER DIODE
|
MIXER DIODE
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
Number of Elements |
2
|
2
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
125 °C
|
100 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
TO-236
|
Manufacturer Package Code |
|
SOT23
|
Forward Voltage-Max (VF) |
|
0.6 V
|
Frequency Band |
|
ULTRA HIGH FREQUENCY
|
JEDEC-95 Code |
|
TO-236AB
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Output Current-Max |
|
0.03 A
|
Peak Reflow Temperature (Cel) |
|
260
|
Rep Pk Reverse Voltage-Max |
|
4 V
|
Terminal Finish |
|
TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HSM88WK with alternatives
Compare PMBD353,235 with alternatives
-
PMBD353,235 vs MMBD353LT1G
-
PMBD353,235 vs PMBD353212
-
PMBD353,235 vs PMBD353
-
PMBD353,235 vs 933912210235
-
PMBD353,235 vs PMBD353/T3
-
PMBD353,235 vs PMBD353T/R
-
PMBD353,235 vs MMBD353LT3
-
PMBD353,235 vs MMBD353LT3G
-
PMBD353,235 vs PMBD353,215