HSMS-2825-TR1G
vs
HSM88WK
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
RENESAS ELECTRONICS CORP
|
| Package Description |
R-PDSO-G4
|
MPAK-3
|
| Pin Count |
4
|
3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.60
|
8541.10.00.60
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| Case Connection |
CATHODE
|
|
| Configuration |
SEPARATE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Capacitance-Max |
0.2 pF
|
0.85 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
MIXER DIODE
|
MIXER DIODE
|
| Forward Voltage-Max (VF) |
0.34 V
|
|
| Frequency Band |
C BAND
|
|
| JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G3
|
| JESD-609 Code |
e4
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
4
|
3
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Dissipation-Max |
0.25 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Current-Max |
0.1 µA
|
|
| Reverse Test Voltage |
1 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Base Number Matches |
1
|
5
|
|
|
|
Compare HSMS-2825-TR1G with alternatives
Compare HSM88WK with alternatives