HSU88 vs PMBD353,235 feature comparison

HSU88 Hitachi Ltd

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PMBD353,235 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Package Description R-PDSO-G2 PLASTIC, TO-236AB, 3 PIN
Pin Count 2 3
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.60 8541.10.00.70
Configuration SINGLE SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Capacitance-Max 0.8 pF 1 pF
Diode Element Material SILICON SILICON
Diode Type MIXER DIODE MIXER DIODE
Forward Voltage-Max (VF) 0.58 V 0.6 V
JESD-30 Code R-PDSO-G2 R-PDSO-G3
Number of Elements 1 2
Number of Terminals 2 3
Operating Temperature-Max 125 °C 100 °C
Output Current-Max 0.015 A 0.03 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 10 V 4 V
Surface Mount YES YES
Technology SCHOTTKY SCHOTTKY
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code Yes
Part Package Code TO-236
Manufacturer Package Code SOT23
Frequency Band ULTRA HIGH FREQUENCY
JEDEC-95 Code TO-236AB
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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