IDT72251L25JI vs 72251L25PFI9 feature comparison

IDT72251L25JI Integrated Device Technology Inc

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72251L25PFI9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFP
Package Description PLASTIC, LCC-32 TQFP-32
Pin Count 32 32
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 15 ns
Clock Frequency-Max (fCLK) 40 MHz
Cycle Time 25 ns 25 ns
JESD-30 Code R-PQCC-J32 S-PQFP-G32
JESD-609 Code e0 e0
Length 13.9954 mm 7 mm
Memory Density 73728 bit 73728 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX9 8KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 1.6 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 11.4554 mm 7 mm
Base Number Matches 3 2

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Compare 72251L25PFI9 with alternatives