IDT72V225L10TF8 vs IDT72225LB10JG8 feature comparison

IDT72V225L10TF8 Integrated Device Technology Inc

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IDT72225LB10JG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP LCC
Package Description LFQFP, QFP64,.47SQ,20 QCCJ,
Pin Count 64 68
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 6.5 ns 6.5 ns
Additional Feature EASILY EXPANDABLE IN DEPTH AND WIDTH
Clock Frequency-Max (fCLK) 100 MHz
Cycle Time 10 ns 10 ns
JESD-30 Code S-PQFP-G64 S-PQCC-J68
JESD-609 Code e0 e3
Length 10 mm 24.2062 mm
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 64 68
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX18 1KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QCCJ
Package Equivalence Code QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.572 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 24.2062 mm
Base Number Matches 1 1

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Compare IDT72225LB10JG8 with alternatives