IS25LP016D-JBLA2
vs
IS25LQ016B-JWLE
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active Unconfirmed
|
Obsolete
|
| Package Description |
Soic-8
|
Die, Die Or Chip
|
| Reach Compliance Code |
Compliant
|
Unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
133 Mhz
|
104 Mhz
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
S-PDSO-G8
|
X-XUUC-N
|
| Length |
5.28 Mm
|
|
| Memory Density |
16777216 Bit
|
16777216 Bit
|
| Memory IC Type |
Flash
|
Flash
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
|
| Number of Words |
2097152 Words
|
2097152 Words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2mx8
|
2mx8
|
| Output Characteristics |
3-State
|
|
| Package Body Material |
Plastic/Epoxy
|
Unspecified
|
| Package Code |
SOP
|
DIE
|
| Package Equivalence Code |
SOP8,.3
|
DIE OR CHIP
|
| Package Shape |
Square
|
Unspecified
|
| Package Style |
Small Outline
|
Uncased Chip
|
| Parallel/Serial |
Serial
|
Serial
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programming Voltage |
3 V
|
3 V
|
| Screening Level |
Aec-Q100
|
|
| Seated Height-Max |
2.16 Mm
|
|
| Serial Bus Type |
Qspi
|
Qspi
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Form |
Gull Wing
|
No Lead
|
| Terminal Pitch |
1.27 Mm
|
|
| Terminal Position |
Dual
|
Upper
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Type |
Nor Type
|
Nor Type
|
| Width |
5.28 Mm
|
|
| Write Protection |
Hardware/Software
|
Hardware/Software
|
| Base Number Matches |
1
|
1
|
|
|
|